Chip scale package, CSP :
Lau, John H.
Chip scale package, CSP : design, materials, processes and applications / John H. Lau, Shi-Wei, Ricky Lee. - New York : McGraw-Hill, 1999. - xxii, 564p : ill. ; 23 cm.
Includes index.
Open access.
0070383049
9853224
Integrated circuits--Design and construction.
Microelectronic packaging.
Chip scale package, CSP : design, materials, processes and applications / John H. Lau, Shi-Wei, Ricky Lee. - New York : McGraw-Hill, 1999. - xxii, 564p : ill. ; 23 cm.
Includes index.
Open access.
0070383049
9853224
Integrated circuits--Design and construction.
Microelectronic packaging.