| 000 | 00972nam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | rea00030896 | ||
| 005 | 20190704021223.0 | ||
| 008 | s1999 nyu e 001 0 eng d | ||
| 010 | _a 9853224 | ||
| 020 | _a0070383049 | ||
| 035 | _z56864 | ||
| 039 |
_a30891 _cTLC |
||
| 100 | 1 | _aLau, John H. | |
| 245 | 1 | 0 |
_aChip scale package, CSP : _bdesign, materials, processes and applications / _cJohn H. Lau, Shi-Wei, Ricky Lee. |
| 260 |
_aNew York : _bMcGraw-Hill, _c1999. |
||
| 300 |
_axxii, 564p : _bill. ; _c23 cm. |
||
| 504 | _aIncludes index. | ||
| 506 | _aOpen access. | ||
| 650 | 0 |
_aIntegrated circuits _xDesign and construction. |
|
| 650 | 0 | _aMicroelectronic packaging. | |
| 700 | 1 | _aLee, Shi-Wei Ricky jt. author. | |
| 949 |
_aBMAIN _cTK7874 _d.L3167 1999 c2 _g56864 _5N |
||
| 949 |
_aBMAIN _cTK7874 _d.L3167 1999 c1 _g56865 _5N |
||
| 961 | _t1 | ||
| 999 |
_c25171 _d25171 |
||