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Chip scale package, CSP : design, materials, processes and applications / John H. Lau, Shi-Wei, Ricky Lee.

By: Contributor(s): Material type: TextTextPublication details: New York : McGraw-Hill, 1999.Description: xxii, 564p : ill. ; 23 cmISBN:
  • 0070383049
Subject(s):
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Holdings
Item type Current library Home library Shelving location Call number Copy number Status Barcode
Books Books Main Campus Library University of Eastern Africa, Baraton Main Stack TK 7874 .L3167 1999 (Browse shelf(Opens below)) 1 Available 56864
Books Books Main Campus Library University of Eastern Africa, Baraton Main Stack TK 7874 .L3167 1999 (Browse shelf(Opens below)) 2 Available 56865
Browsing University of Eastern Africa, Baraton shelves, Shelving location: Main Stack Close shelf browser (Hides shelf browser)
TK 7874 .J333 2008 c.3 Microelectronic circuit design / TK 7874 .J333 2008 c.4 Microelectronic circuit design / TK 7874 .J333 2008 c.5 Microelectronic circuit design / TK 7874 .L3167 1999 Chip scale package, CSP : TK 7874 .L3167 1999 Chip scale package, CSP : TK 7874.65 .D38 1996 Digital integrated circuits / TK 7874.65 .D38 1996 Digital integrated circuits /

Includes index.

Open access.

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